Are We Willing to Hear What “Failure” Has to Say?

Metal fatigue is the common name used to describe the unexpected failure of metal parts by progressive fracturing while in service. The article is a basic introduction to the mechanism of metal fatigue failure. An introduction into accepted theories is provided and relevant design practices to reduce metal fatigue are presented and explained.

DOE Order 5000.3A, "Occurrence Reporting and Processing of Operations Information," investigation and reporting of occurrences (including the performance of root cause analysis) requires the and the selection, implementation, and follow-up of corrective actions. The level of effort expended should be based on the significance attached to the occurrence. Most off-normal occurrences need only a scaled down effort while most emergency occurrences should be investigated using one or more of the formal analytical models. A discussion of methodologies, instructions, and worksheets in this document guides the analysis of occurrences as specified by DOE Order 5000.3A.

Root Cause Analysis (RCA) is rapidly becoming another one of those “flavour of the month” TLAs (Three Letter Acronyms). Like all TLAs, it is easy to get carried away with the hype surrounding the approach. Inevitably, then, the reality doesn’t live up to the expectations created by the hype. But nevertheless, the appropriate application of Root Cause Analysis techniques can yield significant organisational and individual benefits. This paper discusses some of the practical issues surrounding the implementation of Root Cause Analysis processes within organisations, and in doing so, attempts to give some guidance to those wishing to obtain success from their Root Cause Analysis program.

With RCFA being a buzzword of the 90’s, companies are faced with a slew of new vendors with numerous RCFA methods and practices to help you attain quantum results. How do you decide who is going to make you money versus who is going to take your money?

Much has been written on the subject of the “root cause” and “root cause analysis” (RCA) of failures and it is a subject on which it is worth spending considerable time and effort. But first, lets define a “root cause”.

Semiconductor devices are almost always part of a larger, more complex piece of electronic equipment. These devices operate in concert with other circuit elements and are subject to system, subsystem and environmental influences. When equipment fails in the field or on the shop floor, technicians usually begin their evaluations with the unit's smallest, most easily replaceable module or subsystem. The subsystem is then sent to a lab, where technicians troubleshoot the problem to an individual component, which is then removed--often with less-than-controlled thermal, mechanical and electrical stresses--and submitted to a laboratory for analysis. Although this isn't the optimal failure analysis path, it is generally what actually happens.